Additive Manufacture Breakout Board
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Description: This project supports the paper by Cameron K. Brooks, Jack Peplinski and Joshua M. Pearce, Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters. Inventions 2023, 8, 61. https://doi.org/10.3390/inventions8020061 (https://www.mdpi.com/2411-5134/8/2/61 )